e2v launches Assembly and Test services for High Reliability Semiconductors
e2v, the leading designer and manufacturer of specialised semiconductor components, announced today the launch of a complete semiconductor Assembly and Test service dedicated to the high-end electronics industry. From material sourcing and package development through high reliability manufacturing, test and ultimately obsolescence management, e2v’s Assembly & Test capability is geared to support the manufacture of products for 20 years or more.
The newly launched e2v Assembly and Test services facility is made up of a 600 m² Class 100 clean room, wafer probe low/high temperature handlers/probes (-55°C to +200°C), legacy IC and state-of-the-art digital & RF IC and mixed signal IC automatic test equipment (ATE), for packaged IC testing over extended temperatures (-55° to +150°C), and the largest capacity IC burn-in chambers in Europe.
Coupled with this extensive ‘in-house’ Assembly and Test facility, e2v provides package development (design, thermal, electric simulation and test), package assembly including hermetic, ceramic packages (DIL, CHIP-CARRIER, CPGA, CQFP, CBGA), Hi-TCE Flip-Chip assembly on ceramic substrate (CBGA) and Multi-chip modules. Assembly and manufacturing capabilities include automated die and component pick-and-place, gold and aluminium wire bonding, automated epoxy attach, reflow ovens and x-ray analysis.
e2v Assembly and Test services are certified to MIL-PRF-38535 QML level Q and V, and the AS/EN9100 aerospace standard; providing best-in-class manufacturing capability to support a wide range of high reliability applications such as space payloads and platforms, military rugged computers, radar, avionics, flight computers and engine control; alongside industrial applications including transportation, down-hole drilling and industrial computers. Applications include multi-year programs secured through e2v’s ability to offer an obsolescence management programme incorporating long-term semiconductor die availability (die banking to 10 years and more), foundry transfer and product re-engineering options, and the resources to commit to long-term availability of automated test equipment (ATE) and IC test programs. Specific screening requests can also be accommodated.
“Aerospace and defence industries are demanding turn-key product solutions for their IP incorporating the entire product life-cycle; from bare die sourcing to package development and test, manufacturing and obsolescence management.” said Jean-Marie Muller, e2v’s Assembly and Test services Marketing Manager. “Our strategic partners have come to depend on e2v delivering expertise founded in over 20 years experience in the semiconductor market. We are now delighted to extend our services even further”.
Further information, is available from www.e2v,com, or via our dedicated web page at
http://www.e2v.com/products/ccd-and-cmos-imaging-and-semiconductors/assembly-and-test-offer.cfm
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Press contact:
Sylvie Mattei, Communications Manager
Phone: +33 4 76 58 30 25, mailto:sylvie.mattei@e2v.com
NOTES FOR EDITORS
e2v
e2v’s objective is to be a global leader in the design and supply of specialised components and sub-systems that enable the world’s leading systems companies to deliver innovative solutions for medical & science, aerospace & defence, and commercial & industrial markets.
e2v is organised into four divisions:
• High performance electron devices and subsystems for applications including: defence electronic countermeasures, radiotherapy cancer treatment, radar systems, industrial heating, satellite communications amplifiers, digital television transmitters and high power RF systems.
• Advanced CCD and CMOS imaging sensors and cameras for applications including: space, science and life science imaging, industrial process control, intra-oral and panoramic dental X-ray systems and military surveillance.
• Specialist semiconductors, including logic, memory and microprocessors (in partnership with Freescale Semiconductor) for: high reliability mission-critical programmes in avionics, telecommunications and defence, sensor data acquisition, and high speed data conversion.
• A range of professional sensing products for applications including: environmental safety, x-ray spectroscopy, automotive alarm and security systems, microwave radar and safety and arming devices, fire rescue and security thermal imaging.
For the year ended 31 March 2009, e2v achieved sales of £233m and is listed on the London Stock Exchange. In October 2008 e2v acquired QP semiconductor, a leading US-based designer and supplier of specialty semiconductor components used in military and aerospace applications, establishing e2v’s first US manufacturing base.
The Company is headquartered in the United Kingdom and has approximately 1700 employees in six production facilities across Europe and North America. e2v also operates a global network of sales and technical support offices, supported by local distributors and resellers.
Further information is available from www.e2v.com